Beckhoff CB3052 Manual do Utilizador Página 4

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Contents
page 4 Beckhoff New Automation Technology CB3052
4.4.1 CPU Feature ....................................................................................................................... 47
4.4.2 Hard Disk Boot Priority ........................................................................................................ 48
4.5 Advanced Chipset Features ........................................................................................................ 49
4.5.1 PCI Express Root Port Function ......................................................................................... 50
4.6 Integrated Peripherals ................................................................................................................. 51
4.6.1 OnChip IDE Devices ........................................................................................................... 52
4.6.2 Onboard Devices ................................................................................................................. 54
4.6.3 SuperIO Devices ................................................................................................................. 55
4.6.4 USB Device Setting ............................................................................................................. 56
4.7 Power Management Setup .......................................................................................................... 57
4.7.1 PCI Express PM Function ................................................................................................... 59
4.7.2 Intel DTS Feature ................................................................................................................ 60
4.8 PnP/PCI Configuration ................................................................................................................ 61
4.8.1 IRQ Resources .................................................................................................................... 63
4.9 PC Health Status ......................................................................................................................... 64
4.10 Frequency/Voltage Control ......................................................................................................... 65
4.11 Load Fail-Safe Defaults ............................................................................................................... 66
4.12 Load Optimized Defaults ............................................................................................................. 66
4.13 Set Password .............................................................................................................................. 66
4.14 Save & Exit Setup ....................................................................................................................... 66
4.15 Exit Without Saving ..................................................................................................................... 66
5 BIOS update ....................................................................................................................................... 67
6 Mechanical Drawing ........................................................................................................................... 68
6.1 PCB: Mounting Holes .................................................................................................................. 68
6.2 PCB: Pin 1 Dimensions ............................................................................................................... 69
6.3 PCB: Heat Sink ........................................................................................................................... 70
7 Technical Data .................................................................................................................................... 71
7.1 Electrical Data ............................................................................................................................. 71
7.2 Environmental Conditions ........................................................................................................... 71
7.3 Thermal Specifications ................................................................................................................ 72
8 Support and Service ........................................................................................................................... 73
8.1 Beckhoff's Branch Offices and Representatives ......................................................................... 73
8.2 Beckhoff Headquarters................................................................................................................ 73
8.2.1 Beckhoff Support ................................................................................................................. 73
8.2.2 Beckhoff Service ................................................................................................................. 73
I Annex: Post-Codes ............................................................................................................................. 74
II Annex: Resources .............................................................................................................................. 77
A IO Range ......................................................................................................................................... 77
B Memory Range ................................................................................................................................ 77
C Interrupt ........................................................................................................................................... 77
D PCI Devices ..................................................................................................................................... 78
E SMB Devices ................................................................................................................................... 78
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