Beckhoff CB4055 Manual do Utilizador descarregar pdf (Página 4)

Inhalt

Seite 4 Beckhoff New Automation Technology CB4055

5.3.7 Super IO Configuration ....................................................................................................... 49

5.3.8 H/W Monitor ........................................................................................................................ 51

5.3.9 Serial Port Console Redirection .......................................................................................... 53

5.3.10 CPU PPM Configuration ..................................................................................................... 55

5.4 Chipset ........................................................................................................................................ 56

5.4.1 PCH-IO Configuration ......................................................................................................... 57

5.4.2 System Agent (SA) Configuration ....................................................................................... 64

5.5 Boot ............................................................................................................................................. 68

5.5.1 CSM Parameters ................................................................................................................. 70

5.6 Security ....................................................................................................................................... 71

5.6.1 Secure Boot Policy .............................................................................................................. 72

5.6.2 Key Management ................................................................................................................ 73

5.7 Save & Exit .................................................................................................................................. 75

5.8 BIOS-Update ............................................................................................................................... 76

6 Mechanische Zeichnung .................................................................................................................... 77

6.1 Leiterplatte: Bohrungen ............................................................................................................... 77

6.2 Leiterplatte: Pin-1-Abstände ....................................................................................................... 78

6.3 Leiterplatte: Kühlkörper/Die Center ............................................................................................. 79

7 Technische Daten .............................................................................................................................. 80

7.1 Elektrische Daten ........................................................................................................................ 80

7.2 Umgebungsbedingungen ............................................................................................................ 80

7.3 Thermische Spezifikationen ........................................................................................................ 81

8 Support und Service ........................................................................................................................... 82

8.1 Beckhoff-Support ........................................................................................................................ 82

8.2 Beckhoff-Service ......................................................................................................................... 82

8.3 Beckhoff-Firmenzentrale ............................................................................................................. 82

I Anhang: Post-Codes .......................................................................................................................... 83

II Anhang: Ressourcen .......................................................................................................................... 84

IO-Bereich ............................................................................................................................................... 84

Memory-Bereich ..................................................................................................................................... 84

Interrupt................................................................................................................................................... 84

PCI-Devices ............................................................................................................................................ 85

Ressourcen: SMB-Devices ..................................................................................................................... 85

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